• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    Device comprising at least one semiconductor component (1) connected to an electrical interconnection element (5), which electrical interconnection element (5) is attached to a heat sink (2) and connected to a beam (3) ) of electrical wires, the bundle (3) is mechanically and electrically connected to the electrical interconnection element (5) by a single connector (7), the bundle (3) being connected to the dissipator (2) by means of holding (8).
    公开号:FR3026468A1
    申请号:FR1459309
    申请日:2014-09-30
    公开日:2016-04-01
    发明作者:Eric Mornet；Bruno Ducloux；Nadia Yacoubi；Remi Letoumelin；Jean-Claude Puente；Franck Matte；Didier Jacquemin
    申请人:Valeo Vision SA；
    IPC主号:
    专利说明:

    [0001] The invention relates to a semiconductor device device mounted on a heat sink, the semiconductor component being connected to a heat sink device, a mounting method, and a lighting device for a motor vehicle. to an electrical interconnection element. The invention furthermore relates to a method of mounting the aforementioned device, and to a light device for a motor vehicle comprising such a device. The present invention finds its application more particularly in the context of mounting a light source in a motor vehicle headlight.
    [0002] In the field of automotive lighting, it is known, when using light-emitting diodes (or LEDs for "LightEmitting Diodes" in English, which is a semiconductor component) as a light source, to mount these LEDs on an electrical interconnection element, for example of the printed circuit board (or PCB type for Printed Circuit Board in English), providing the electrical connection between the components mounted thereon, and then disposing the LED assembly - PCB thus obtained on a heat sink (typically a radiator). This heatsink, intended to cool the LED in operation (and function as a projector radiator), is subsequently mounted in the projector on a support, for example a reflector of the projector. In particular, the soldering of the components on the printed circuit board consists of a method of depositing a solder paste, placement of the components followed by a passage in a reflow oven where the solder paste melts and resolidifies in order to to fix the electronic components. Among these electronic components, there will be for example one or more LEDs, a connector, capacitors, resistors. In addition, to ensure the electrical connection of the components with the rest of the vehicle, is also sold on the card a first connector portion (female part). The assembled board is then placed on the heat sink which is after disposed on the projector support. Once the heat sink placed on its support, the electrical connection between the printed circuit board and the rest of the vehicle is achieved by the junction of a second connector portion (male portion) to the first, the second connector portion being electrically connected to a bundle of electrical wires for operating said link. In this way, the placement of the heat sink on the support is not disturbed by the presence of floating electrical son which can be a hindrance to rapid assembly when these electrical son are free to move and occupy the connection spaces defined between the heatsink and the support. However, if the known method of the state of the art allows the operator who carries out the mounting of the semiconductor component to be released from an additional step of management of the electrical son during the placement of the heat sink on his support, the latter however presents a major pitfall: it is expensive, insofar as, on the one hand, the choice of materials relating to the manufacture of the first connector part is dictated by constraints of implementation of the card printed circuit board, namely, high temperatures (in a range of values between about 200 ° C and about 300 ° C) to which the first connector portion must resist. These temperatures correspond in fact to the temperatures encountered during the soldering step of the first connector portion mounted on the printed circuit board. On the other hand, the mounting method as known from the state of the art is particularly long since once the dissipator placed on its lighting support, it is then necessary to connect the second connector part, connected to the wiring harness, to the first connector portion present on the printed circuit board, and this, in a confined space, and therefore not very accessible, defined between the support and the dissipator, which can be difficult. This difficulty is further increased by the presence of floating electrical wires which hinder the visibility of the operator during the connection operation of the two connector parts and which are furthermore capable of being interposed between the mechanical elements to be mounted, at this stage of the process or at a later stage. Then, the known method of the state of the art requires additional operations, and subsequent to the connection of the two connector parts, which consist of carrying out tests with a dedicated hardware to verify that the connection between the two parts of the connector connector is properly established. The duration of the known method of the state of the art is undoubtedly a loss of profitability when it comes to implement such a large-scale process (that is to say, on a series of projectors processed at the chain). The invention aims to overcome the drawbacks of the state of the art by providing a mounting method of a less expensive embodiment of light device while allowing a satisfactory reliability and easy assembly and therefore fast different elements said light device. To solve this problem, there is provided according to the invention a device comprising at least one semiconductor component connected to an electrical interconnection element, which electrical interconnection element is attached to a heat sink and connected to a beam of electrical wires, the beam being mechanically and electrically connected to the electrical interconnection element by a single connector, the beam being connected to the dissipator by a holding means. The invention also relates to a method for mounting a semiconductor component on a heat sink, the semiconductor component being connected to an electrical interconnection element, which method comprises: a first step of fixing and connecting a bundle of electrical wires to the electrical interconnection element; a second step of fixing the beam on the heat sink; and a third step of fixing the electrical interconnection element on the heat sink.
    [0003] In this way, in the context of the particular application of the invention relating to the mounting of a light source in a motor vehicle headlight, the operator can first attach the beam to the interconnection element. an electrical board (for example a printed circuit board), attach the bundle to the heat sink, fix the printed circuit board to the heatsink, and then place the heatsink on the projector stand, so that on the one hand , allow the operator to free himself from the management of the beam during the fixing of the card and the heat sink, and, on the other hand, to avoid the free movement of the beam during assembly of the light device.
    [0004] Thus, the mounting of a semiconductor component on a heat sink according to the invention not only saves installation time since the operator can first easily connect the beam to the circuit board. printed to then fix and guide the beam in a non-binding position when mounting the card and the heat sink, but also a gain in manufacturing cost of the printed circuit board since it is no longer necessary to have a first connector portion placed on the board and arranged to be connected to a second connector portion connected to the wiring harness.
    [0005] In fact, the invention allows the operator to use a single monoblock type connector that can be attached to the printed circuit board. This connector is inserted in metallized holes of the electronic board to be fixed by welding to the selective wave. The connector housing will experience temperatures well below the temperatures of 200 ° C to 300 ° C which are used in a conventional reflow oven. This single connector must no longer necessarily be made of a material specifically adapted to withstand the high temperatures relative to the conventional reflow oven. Additionally, it is observed that the step of fixing the bundle of electrical wires on the heat sink allows, in operation, to avoid frictional wear of the beam on the surface or on the angles of the heat sink or the heat sink. support when the beam is no longer free to move under the effect of the vibrations generated by the operation of the motor vehicle since it is maintained in a predefined position. According to various embodiments of the device according to the invention, which can be taken together or separately: the semiconductor component is a semiconductor emitter chip, preferably a light emitting diode; the heat sink is connected to a motor vehicle headlamp support, preferably to a motor vehicle headlight reflector or a vehicle taillight holder; the electrical interconnection element is a printed circuit board; the beam is connected to the dissipator by a holding means comprising at least a first tab formed projecting from a surface of the heat sink, the bundle of electrical wires being held between said tab and the surface, the holding means comprises a second lug formed protruding from the surface of the heat sink, the bundle of electrical wires being held between the first and second lugs and the surface; - The beam is mechanically connected to the dissipator by a holding means comprising a first portion formed by a clamping collar traversed by said beam and a second portion formed of a foot of a thermal insulating material fixing the clamp to the sink heat ; the dissipator is substantially L-shaped; the holding means is on one of the limbs of the dissipator L; the dissipator comprises openings.
    [0006] According to various embodiments of the method according to the invention, which can be taken together or separately: the first step consists of a fixing and an electrical connection of a connector, which connector is electrically and mechanically connected to the beam, on the electrical interconnection element; the second step consists in bringing the beam between at least a first tab formed projecting from a surface of the heat sink and the surface of the heat sink, so that the beam is held between said tab and the surface of the dissipator of the heat sink; heat; the second step further comprises bringing the beam between a second lug projecting from the surface of the heat sink and the surface of the heat sink, so that the beam is held between the first and second lugs and the surface of the heat sink; the second step consists in bringing the bundle through a clamping collar, the collar being extended by a foot made of a thermal insulating material, the collar being fastened to the dissipator by said foot; the second step of fixing the bundle is carried out before or after the third step of fixing the electrical interconnection element to the heat sink; and the method according to the invention further comprises a fourth step of mounting the heat sink on a support of a motor vehicle headlamp. Finally, the invention relates to a light device for a motor vehicle, comprising the device according to the invention. Other features and advantages of the invention will emerge from the description given below, in a non-limiting manner. Figures 1a to 1 illustrate a first embodiment of the method of mounting a semiconductor component on a heat sink according to the invention. Figures 2a and 2b illustrate a second embodiment of the method of mounting a semiconductor component on a heat sink according to the invention. Figures 3a and 3b show the device from the first embodiment of the method of the present invention. Figures 4a and 4b illustrate the device according to Figures 3a and 3b in a projector. In these figures the analogous elements have the same reference.
    [0007] The steps of mounting a semiconductor electronic component 1 on a heat sink of the first embodiment of the method of the present invention are illustrated in Figs. The aforementioned mounting method comprises a first step in which a bundle 3 of electrical wires is attached to a back face of an electrical interconnection element 5 which is a printed circuit board (PCB) supporting on its front face 6 the semiconductor component, for example a light emitting diode (LED) 1 (Figure la). An alternative to the embodiment in which the LED is mounted on the PCB 5 is that the LED is directly mounted on the heat sink and then connected to the PCB, for example by wire bonding. During this first step, the bundle 3 of electrical wires is fixed to the PCB 5 by means of a monoblock connector 7 (or single connector) electrically and mechanically connected to the bundle 3, so that the PCB 5 is connected physically and electrically to each of the electrical wires of the beam 3. The connection is made by inserting, from the back face of the PCB 5, a plurality of contacts 7a present on the monoblock connector 7 in holes 7b metallized connection formed in the PCB 5, the connector 7 is then soldered directly to the PCB 5 by wave soldering. FIG. 1b illustrates the second step 1b of fixing the beam 3 on the heat sink 2 by means of a holding means 8 of the bundle 3. The heat sink 2 is defined by a first part P1 and a second part P2 connected directly to one another and for example substantially CL-shaped, that is to say oriented so that a first plane tangent to the first part and a second plane tangent to the The second part form a substantially straight angle.
    [0008] Preferably, the dissipator 2 comprises openings intended to allow the circulation of air. In the first embodiment of the method according to the invention, the second step 1b consists of a supply of the beam 3 through a first part of the holding means 8 which is a clamping collar 8a, the collar 8a being extended by a second part of the holding means 8 which is a foot 8b snap. The foot 8b comprises a detent branch 8c and two fins 8d, 8d 'of support on the heat sink 2.
    [0009] The detent branch 8c originates on one end of the foot 8b where each of the fins 8d, 8d 'is connected and has two elbows 8e, 8e' (or fins) projecting from the detent branch 8c in directions opposed to each other, so as to form a detent boom consisting of the detent branch 8c and the two elbows 8e, 8e ', this boom being arranged to be introduced into a first orifice 8f present on the heat sink 2, for example on its second part P2. Once the bundle 3 has been taken up in the clamp 8a, the detent branch 8c is introduced (FIG. 1c) into the first orifice 8f so that the elbows 8e, 8e 'completely go through the first orifice 8f and that when the snap arm introduced into the first port 8f, the two fins 8d, 8d 'bear on a first face 9 of the second part P2, while the elbows 8e, 8e' bear on a second face 9 'of the second part P2, opposite to the first face 9. In this way, the foot 8b is held in abutment on each of the first and second faces 9,9 'of the second portion P2 of the heat sink 2 and the collar 8a is thus connected to the heat sink 2. Preferably, the detent leg 8c and the two elbows 8e, 8e 'form a single boom-shaped attachment piece made of a flexible material, so that this attachment piece can be easily introduced through the first orifice 8f by simple pushing, the connecting piece, and in particular the bends 8e, 8e ', which can be deformed during the passage through the first orifice 8f and then resume its initial shape of arrow, so as to that the elbows 8e, 8e 'can bear on the second side 9' of the second part P2 of the heat sink 2. Preferably, the foot 8b is made of a thermal insulating material so that the beam 3 is thermally decoupled from the heat sink 2 when the LED 6 is in operation and there heating of the heat sink 2.
    [0010] Once the beam 3 attached to the heat sink 2, the PCB 5 is fixed in a third step 1 d (Figure 1d) on the first part P1 of the heat sink 2. The fixing of the PCB 5 (Figure 1c) is carried out by any known means, for example by crimping at least one pin 51 of generally cylindrical shape projecting from the first portion P1 of the heat sink 2 and arranged to be inserted in a second orifice 52 (or a cavity) arranged in the PCB to fitly receive the pin 51, which will then be crushed to fill the orifice 52 so that the card is irreversibly connected to the first part P1 heat sink 2. Preferably, the PCB 5 is in thermal contact with the heat sink 2, so as to be able to control the temperature of the heat sink 2 and to modulate the intensity of the electric current passing through the LED in order to guarantee its reliability by avoiding exceed its minimum junction temperature. The temperature can be controlled via a thermistor connected to the LED and to the PCB 5. Preferably, steps 1a-1d of the first embodiment of the claimed method are performed consecutively, but not necessarily.
    [0011] Advantageously, the second step 1b for fixing the bundle 3 is carried out before or after the third stage 1c of fixing the PCB 5 is completed. As soon as the bundle 3 and the PCB 5 are fixed to the dissipator 2 of the heat to form a device forming a dissipator assembly 2 - beam 3 - PCB 5 as shown in Figure 3, this assembly can then be mounted, in a fourth step, shown in Figure 1a, on a support 10 of a motor vehicle headlight. In an alternative embodiment, the assembly can be mounted both on a front projector support and on a rear light support of the vehicle. As shown in FIGS. 3a and 3b, after the completion of steps 1a-1d, a first device is obtained comprising an LED 1 carried by the PCB 5 to which the LED 1 is electrically connected. The PCB 5 is fixed on the first part P1 of the heat sink 2 and connected to the bundle 3 of electrical wires by the monobloc connector 7. The bundle 3 is fixed on the second part P2 of the heat sink 2 via the holding means 8 comprising the clamp 8a crossed by the beam 3 and the foot 8b 20 fixing the clamp 8a to the heat sink 2. The fourth step of mounting the heat sink 2 on a support 10 of a motor vehicle headlamp is shown in Figures 4A and 4B. It is achieved by connecting for example the first part P1 of the heat sink 2 to the support 10 via 25 connection means comprising for example: a screw 10a arranged to pass through a third port present on the first part P1 and to be housed in a second cavity 10b of the support 10 having an internal thread complementary to that of the first screw; 30 and a positioning pin 10e of the reflector makes it possible to ensure the positioning of the radiator in the Y direction (horizontal axis perpendicular to the movement of the vehicle, the usual reference used by the operator) through the oblong hole 10d. As shown in Figures 4a and 4b, the fourth step provides a light device for a motor vehicle comprising the first device described above which is connected to the support 10 of the projector.
    [0012] When performing this fourth step 1c, the placement of the heat sink 2 on the support 10 is not disturbed by the presence of floating electrical wires and is therefore performed more quickly than the state of the art mounting method. 'art. In addition, in the method according to the invention, the connector, when it is connected to the PCB before fixing the latter on the heat sink, must no longer be a two-part connector, in particular , as explained above, a monobloc connector will be preferred since this choice is a gain of material and, moreover, this connector must no longer be welded by a welding process requiring a material specifically adapted to withstand the high temperatures between 200 ° C to 300 ° C A second alternative embodiment of the method according to the invention is illustrated in Figures 2a and 2b.
    [0013] This second embodiment has a first and a fourth step common to that of the first embodiment. On the other hand, this second mode differs from the first embodiment in that the second step 2b consists in bringing the bundle 3 between a first tab 11a and a second tab 11b and a surface S of the heat sink 2 defined on the first face 9 of the dissipator 2. In this way, the beam 3 is maintained between the tabs 11a, 11b and the surface of the heat sink, each of the tabs being formed protruding from the surface S. In an alternative embodiment, it only one leg is formed from the dissipator 2 to maintain the beam 3, which leg can be folded if necessary after arrangement of the beam to block the potential relative movements of the electrical harness. Optionally, the second portion P2 of the dissipator comprises a fourth orifice 12, each of the tabs 11a, 11b protruding from the edge of the fourth orifice 12 under the tabs 11a, 11b connecting the first face 9 to the second face 9 '. The presence of this fourth orifice makes it possible to facilitate the placement of beams 3 of large diameters since, during the placement of this type of beam between the dissipator and each of the tabs 11a, 11b, a part of the beam, whose diameter is for example greater than at the distance L, defined between the tabs 11a, 11b and a horizontal plane passing through the surface S, can be accommodated in the orifice 12 and the beam is held in a vice between, on the one hand, the two tabs 11a , 11 b, and, secondly, a first 13 and a second 14 surface portions S defined on either side of the orifice 12.
    [0014] In this context, the second embodiment of the mounting method is less expensive and faster than the first embodiment for this method. Indeed, since the beam is directly connected to the dissipator 2 by the tabs 11a, 11b formed protruding from the surface S of the heat sink 2, it avoids the use of a specific part on the electrical harness of the radiator. The device obtained from the second embodiment of the method according to the invention therefore differs from the first device from the first embodiment of the mounting method in that the holding means 8 comprises a first and a second lugs 11a, 11b. protruded from the surface S (Figure 2a) of the heat sink 2, the bundle 3 of electrical son being maintained between the first and the second tabs 11a, 11b and the surface S. If the description relates to a mode of preferential embodiment of the method according to the invention and the device obtained by such a method in which the semiconductor component is a light emitting diode, the dissipator is a projector radiator, and the electrical interconnection element is the PCB, it It is understood that the present invention is not limited to these features but also covers other embodiments involving other semiconductor components, other heat sinks of the semiconductor component, as well as other electrical interconnection elements.
    权利要求:
    Claims (12)
    [0001]
    REVENDICATIONS1. Device comprising at least one semiconductor component (1) connected to an electrical interconnection element (5), which electrical interconnection element (5) is attached to a heat sink (2) and connected to a beam (3) of electric wires, the beam (3) is mechanically and electrically connected to the electrical interconnection element (5) by a single connector (7), characterized in that the beam (3) is connected to the dissipator (2) by a holding means (8).
    [0002]
    2. Device according to claim 1, characterized in that the semiconductor component (1) is a semiconductor emitter chip, preferably a light emitting diode.
    [0003]
    3. Device according to one of the preceding claims, characterized in that the heat sink (2) is connected to a support (10) in a motor vehicle headlamp, preferably to a reflector, or in a rear lights holder of vehicle.
    [0004]
    4. Device according to one of claims 1 to 3, characterized in that the electrical interconnection element (5) is a printed circuit board.
    [0005]
    5. Device according to any one of claims 1 to 4, characterized in that the holding means (8) comprises at least a first lug (11a) projecting from a surface (S) of the heat sink (2). the bundle of electrical wires (3) being held between said tab (11a) and the surface (S).
    [0006]
    6. Device according to claim 5, characterized in that the holding means (8) comprising a second lug (11b) projecting from the surface (S) of the dissipator (2) heat, the bundle of electrical son ( 3) being held between the first (11a) and the second (11b) tabs and the surface (S).
    [0007]
    7. Device according to any one of claims I to 4, characterized in that the beam (3) is mechanically connected audissipateur (2) by a holding means (8) comprising a first portion formed by a collar (8a) of clamped through by said beam (3) and a second portion formed of a foot (8b) of a thermal insulating material fixing the clamp (8a) to the heat sink (2).
    [0008]
    8. Device according to one of the preceding claims, characterized in that the dissipator (2) is substantially L-shaped.
    [0009]
    9. Device according to claim 8, characterized in that the holding means (8) is on one of the branches of the L of the dissipator (5)
    [0010]
    10. Device according to one of the preceding claims, characterized in that the dissipator (2) comprises openings.
    [0011]
    11. A method of mounting a semiconductor component (1) on a heat sink (2), the semiconductor component (1) being connected to an electrical interconnection element (5), which method is characterized by: a first step (1a) of fixing and connecting a bundle of electrical wires (3) on the electrical interconnection element (5) by a single connector (7); a second step (1b) of fixing the beam (3) on the heat sink (2) by a holding means (8); and a third step (1c) of attaching the electrical interconnection element (5) to the heat sink (2).
    [0012]
    12. Lighting device for a motor vehicle, characterized in that it comprises the device according to any one of claims 1 to 10.
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    同族专利:
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    US10670221B2|2020-06-02|
    EP3002511A1|2016-04-06|
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    US20160091164A1|2016-03-31|
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    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    DE202004003793U1|2004-03-11|2004-05-13|Hella Kg Hueck & Co.|Light emitting diode assembly for fitting into cars, comprises cooler for dissipating waste heat and directly supporting LEDs and electronic components|
    FR2889290A1|2005-07-29|2007-02-02|Koito Mfg Co Ltd|Vehicle headlamp for forming low-beam light distribution pattern, has light source units each with resin shade fastened to metal bracket by fastening screw, where shade has rear end part made of metal and fastening shade to bracket|
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    FR3001027B1|2013-01-15|2015-03-20|Valeo Vision|LIGHTING MODULE AND METHOD FOR MOUNTING SUCH A MODULE|
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    CN103994415A|2014-05-29|2014-08-20|江苏迅驰汽车部件有限公司|LED module radiating structure for automobile head lamp|FR3056679B1|2016-09-27|2020-09-04|Valeo Vision|DEVICE WITH MASTER AND SLAVE LIGHT MODULES|
    AT519774B1|2017-03-23|2018-12-15|Zkw Group Gmbh|Light module for a motor vehicle headlight|
    FR3074881A1|2017-12-07|2019-06-14|Valeo Vision|LUMINOUS MODULE FOR MOTOR VEHICLE|
    JP2019153460A|2018-03-02|2019-09-12|株式会社小糸製作所|Vehicle lamp fitting|
    JP2020119768A|2019-01-24|2020-08-06|スタンレー電気株式会社|Vehicle lighting appliance|
    法律状态:
    2015-09-30| PLFP| Fee payment|Year of fee payment: 2 |
    2016-04-01| PLSC| Search report ready|Effective date: 20160401 |
    2016-09-28| PLFP| Fee payment|Year of fee payment: 3 |
    2017-09-29| PLFP| Fee payment|Year of fee payment: 4 |
    2018-09-28| PLFP| Fee payment|Year of fee payment: 5 |
    2019-09-30| PLFP| Fee payment|Year of fee payment: 6 |
    2020-09-30| PLFP| Fee payment|Year of fee payment: 7 |
    2021-09-30| PLFP| Fee payment|Year of fee payment: 8 |
    优先权:
    申请号 | 申请日 | 专利标题
    FR1459309A|FR3026468B1|2014-09-30|2014-09-30|SEMICONDUCTOR COMPONENT DEVICE MOUNTED ON A HEAT SINK, MOUNTING METHOD, AND LIGHTING DEVICE FOR MOTOR VEHICLE HAVING SUCH A DEVICE|
    FR1459309|2014-09-30|FR1459309A| FR3026468B1|2014-09-30|2014-09-30|SEMICONDUCTOR COMPONENT DEVICE MOUNTED ON A HEAT SINK, MOUNTING METHOD, AND LIGHTING DEVICE FOR MOTOR VEHICLE HAVING SUCH A DEVICE|
    EP15186929.4A| EP3002511B1|2014-09-30|2015-09-25|Device with semiconductor component mounted on a heat sink, mounting method, and lighting device for a motor vehicle comprising such a device|
    US14/868,922| US10670221B2|2014-09-30|2015-09-29|Semiconductor-component device assembled on a heat sink, assembly method, and lighting device for a motor vehicle including such a device|
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